‘HTM’ Closed Cell Silicone Sponge
J-Flex ‘HTM’ Thermally Conductive Silicone Sponge is ideal for gaskets and pads, where compressibility and good heat transfer is required.
Thermal conductivity is provided by the addition of fillers, such as ceramic or boron nitride particles, to premium grade expanded closed cell silicone sponge.
Features
- Used to cool heat generating electronic components by transferring heat to heat sinks and metal housings for dissipation.
- Used to deliver heat for heat sealing and hot stamping applications used in the packaging of food products and drugs.
- Used to heat seal small plastic containers – the base silicone rubber compound resists sticking to melted plastics and most hot melt adhesives, providing a release surface.
Uses
Temperature Range:
-60°C to 200°C
A Thermally Conductive Silicone Sponge, ideal for gaskets and pads, where compressibility and good heat transfer is required.
Availability
Colours: Light Green
| Thickness | Length | Width |
|---|---|---|
| 3.0mm | 1m | 1m |
| 4.0mm | ||
| 5.0mm | ||
| 6.0mm | ||
| 8.0mm | ||
| 10.0mm | ||
| 12.0mm | ||
| 15.0mm | ||
| 20.0mm | ||
| 25.0mm | ||
| 30.0mm | ||
| 40.0mm |
Technical Properties
| Property | Typical Value | Test Method |
|---|---|---|
| Compound Ref: | JF/HTM/Sponge | Norm |
| Density | 0.4/0.45 gr/m3 | DIN 53479 |
| Tensile | 3.5 MPa | DIN 53504 |
| Elongation @ Break | 250% | DIN 53504 |
| Temperature Range | -60ºC to +200ºC continuous | |
| Colour | Light Green | |
| Thermal Conductivity | Mean average after test = 0.0695W / (m.k.) | |
The material was tested in accordance with BS874: Appendix C : 1973, by the heatflow meter method and expressed in ‘SI’ units. Tests carried out @ 123ºC (mean temperature).
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